Products

Thermal Simulation Flow

Design and analysis of the structures and mechanisms from device to system by thermal simulation that efficiently improve the performance of thermal in complex system and experimental condition.

Thermal Simulation Capability

Thermal Simulation

• Socket and PCB assembly under Burn In Board conditions.
• IC Package Thermal Resistance in Systems.
• CP Wafer Testing under low and high temperature conditions, support transient analysis.

Structure Simulation

• Analyze PCB Deformation caused by stress exerted by probe pin, the PCB can be installed with a stiffener or system assembly condition.
• MLO/MLC solder ball material change analysis of crack and reliability.

Thermal-Structural Simulation

• Thermal deformation of MLO and PCB assembly, include PAD position measurement under low to high temperatures.
• Solder ball cracks analysis caused by thermal shock condition.

Electro-Thermal Simulation

• Socket and PCB assembly under Burn In Board conditions, pogo pin and PCB include electric simulate non-uniform power caused by experimental input current conditions.