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Direct investment in March for the setup of a sub-subsidiary, Shanghai Xincheng Technology Co., Ltd.

Acquisition of subsidiary Relight Technologies Co., Ltd. In March through corporate merger.

The application for listing at the Taipei Exchange for trading was approved in January after passing by the review board.
Listed at Taipei Exchange for trading in April.

Relocation to the new building of the corporate headquarters at Zhuangjing North Road in January, and change the company address to this new address.
Application for public offering in April.
Registration at the Emerging Stock Market in May.

Introduction of Flying Probe Tester.
Successful development of the extra-large PCB integrated process technology (610mm x 610mm).
Successful development of the 77Ghz substrate design and measurement and testing technology.

Purchase of the land located at Zhuangjing Road in March and offered the bid of the contract for the construction of the new corporate headquarters building in December.
Launch of Probe Card + Substrate + Probe Head Total Solution.
Merger of 毓祥科技 into Keystone Microtech Corporation.
Launch of the advanced FPGA development platform to offer quality products and services superior at a much higher level of the same kind as compared with overseas firms. Successful entry to the domestic IC design house.

Launch of the customized high-speed, high-performance IC Burn-in Board.
Accredited with the ISO-9001 quality management system.
Procurement of the SMT Line facility to develop advanced PCB and Substrate assembly process technology.

Establishment of the measurement and testing laboratory for the probing of precision dimension of board thickness and flatness.
Launch of the multi-dut RF/PMIC WLCSP direct-docking probe card.

Establishment of the Shanghai Office to serve the customers in Mainland China.
Development of the flying probe tester for assuring congruence of assembly quality and electric properties test to provide full range of verification testing and strong capacity in product repair and service.

Establishment of the Tainan Office.
Launch of the cell phone chip POP packing and testing substrate, and integration of O/S and full-speed LPDDR2 to accomplish one-stop service of testing.

Launch of the advanced AP/Baseband Load Board to develop the capacity in strong-current, low-voltage and high-speed PCB design and production.
Investment for the establishment of Relight Technologies Co., Ltd. to provide RF communication modules and systems.

Launch of the high-speed FPGA module like the DDR/LVDS/HDMI. Successful launch of mass production of DTV chips FT. This move helped to vitalize the utility rate of low-end machine and increase the market share of high-speed digital substrate.
Investment for the establishment of 毓祥科技股份有限公司 for the exclusive engagement in PCB engineering design and manufacturing service.

Unveiling the DDR3 1866Mbps suspended probe card for the big firms using in advanced production process, the first of its kind in market thus far.
Launch of the DDR2/DDR3 socket board for memory measurement and testing.
Engagement in a joint venture with Yokowo of Japan for the launch of the coaxial socket RF prober, the first of its kind thus far.

Keystone Microtech Corporation was officially incorporated with paid-in capital amounted to NT$63,500,000.
The launch of the RF Load board solution for Company M to solve the problem of bottle neck in the production capacity of the RF chip FT mass production.